Geneva group March 2001
Tracker ground support equipment
Silicon detector structure (PA fig. 3.13-3.16)
n/p-doped Si (PA fig. 3.2-3.5)
p-n junction (PA fig. 3.7-3.10)
Field and depletion width at p+nn+ junction (PA fig. 3.11, 3.12)
Punch through method (PA fig. 3.17-3.20)
MOSFET and FOXFET (PA fig. 3.12-3.24
AMS daisy chaining (PA fig. 3.25, 4.9)
Noise contributions (PA fig. 3.31-3.33)
AMS-01 and AMS-02 sensors (PA fig. 4.3)
Sensor metalization and structure (NIM fig. 2.58, PA fig. 5.1)
Gate and p-stop (PA fig. 4.4-4.6)
Antireflective sensors (PA fig. 4.7, 4.8)
Front end hybrids (PA fig. 4.13, 4.14)
K5, K7 Upilex (PA fig. 4.11,4.12)
VA64hdr_9 (PA fig. 4.16, 4.17)
VA reset, readout and test sequence (PA tab. 4.5)
HCC control sequence (PA fig.4.18)
AMS-01 and AMS-02 biasing method (PA fig. 4.20)
Probe station (PA fig. 6.1-6.3)
Sensor alignment precision (NIM fig. 2.60)
Upilex gluing tools (PA fig. 5.4)
Upilex gluing steps (PA fig. 5.5-5.7)
Reinforcement gluing steps (PA fig. 5.8-5.13)
K-hybrid gluing steps (PA fig. 5.14-5.16)
S-hybrid gluing steps (PA fig. 5.17-5.20)
Hybrid spacer and thermal grease (PA fig. 5.21-5.23)
Feet gluing steps (PA fig. 5.21-5.23)
Spacer gluing and shield wrapping
Ladders ready for mount (NIM fig. 2.61)
AMS-01 plane with AMS-02 ladder
Odd layers longitudinal tolerance
Geneva integration crew 2003 
Geneva clean room 
Clean room equipment 
Band structure (PA fig. 3.1) 
Ladder exploded view 
Hybrid box 
K6 Upilex (PA fig. 4.10) 
Sensor positioning 
Bonding at CERN 
Feet gluing 
Hybrid gluing (by hand) 
Quarter plane vibration test 
Thermal bars 
Ladder fixation odd layers 
Legs on even and odd layers 
Layer 2 
Layer 3 
Layer 4 
Tracker shell dry assembly 
Tracker model