AMS Geneva Memo

Procedure for hybrid qualification

The hybrids are assembled at the SELMIC company Finland. This document describes the qualification procedure that will be performed by the company prior to shipping the hybrids to the various ladder assembly places.

1. The PCB is mounted with passive components, connector and hex inverter. The cable saver is inserted. The number written on the saver is written in the documentation.
2. The PCB is hooked to the PC card, the program STATIC is run and different voltages are measured and written in the documentation
3. The VA, capacitors and PCB are glued to the ceramic. Bonds are made between VAs and capacitors and between VAs and PCBs
4. The hybrid is hooked to the PC card
5. The program SCOPE is run and the operator looks for pathology. If it is a K hybrid then the name of the temperature sensor is recorded and written in the documentation.
6. The program CALIB is run
7. PAW is used with SHOWCAL.KUMAC to look for performaces and pathology
8. The output file of CALIB is renamed and transferred to the Geneva database, according the instructions in document How to qualify a ladder using the Geneva PC card system.
9. The hybrid is put on the provided jigs. A good shipping package is made.
10. The hybrid is shipped to the final destination, according to provided instructions
11. A physicist in Geneva will look at all the plots and declare if the hybrid is suitable for use.